JEDEC Trays

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JEDEC Tray For BGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with BGA PackagingAbsolutely protect the solder balls: No positioning surface of the tray shoul ...

2026-07-09

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JEDEC Tray For QFN Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFN PackagingDo not contact the solder pads/exposed thermal pad and lead surface: No suppo ...

2026-07-09

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JEDEC Tray For QFP Packages

Reference Factors for Designing JEDEC TRAYs Compatible with QFP PackagingFirstly, the body dimensions, lead tip-to-tip spacing, and lead height serve ...

2026-07-09

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JEDEC Tray For LGA Packages

Reference Factors for Designing JEDEC TRAYs Compatible with LGA PackagingAbsolutely do not contact the exposed lands/contact surfaces: No positioning/ ...

2026-07-09

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JEDEC Tray – MPPO Material

Why JEDEC trays use MPPO Material (Modified PPO)High Heat ResistanceMPPO has a high glass transition temperature (BAKE/12H MAX 150 °C).Trays can withs ...

2026-07-09

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JEDEC Tray – PPE Material

Why JEDEC Trays Use PPE MaterialDimensional Stability at High TemperaturesTrays must survive reflow soldering processes (MAX 150 °C) without warping.P ...

2026-07-09

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JEDEC Tray – PEI Material

Why JEDEC Trays Use PEI MaterialVery High Heat ResistancePEI has a glass transition temperature (Tg) ≈ 215 °C.Withstands high-temperature reflow (≥150 ...

2026-07-09

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JEDEC Tray For Module Packages

Reference Factors for Designing JEDEC TRAYs Compatible with MODULE PackagingAbsolutely avoid pressing or damaging pins, solder balls, or exposed conne ...

2026-07-09

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End-Clips For JEDEC Tray

End-clips are small identification accessories designed to be attached to both ends of JEDEC trays. With their compact size and availability in multip ...

2026-07-09

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JEDEC Tray Cover

JEDEC tray covers are protective lids designed to shield components inside JEDEC trays from dust, static, and mechanical damage. They fit securely ove ...

2026-07-09

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